Latest about RAM
Chinese memory maker gets $2.4 billion to build HBM for AI processors — Shanghai packaging facility to open in 2026
CXMT to invest $2.4 billion to build advanced packaging fab to build HBM memory for AI.
Micron is the last memory maker to join the EUV party
Micron reiterates its plans to use EUV for high-volume DRAM production next year as it starts pilot production on a 1-gamma node.
Teamgroup's T-Force Dark AirFlow D5 memory cooler looks like a GPU cooler
Cooling down while looking...cool?
SureCore announces low power cryogenic memory technology for quantum computing
Quantum computers can get chillier for cheaper.
Kingston unveils new CAMM2 RAM modules
Kingston's DDR5 CAMM2 module has been shown in person at Computex 2024 in motherboards, making it among the first desktop CAMM2 modules ever.
TeamGroup's LPDDR5X CAMM2 memory modules get Expert AI branding, become the third consumer option
TeamGroup is ready to release its first LPDDR5X CAMM2 memory modules called the T-Create Expert AI, and aimed at AI notebooks.
Leak suggests that DDR6 development has already started, aiming for 21 GT/s
Industry looking forward to develop DDR6 already: No decision on signaling standard have been made yet, but the final spec is expected in Q2 2025.
Samsung reveals 16-layer 3D DRAM plans with VCT DRAM as a stepping stone
Samsung's RAM innovation roadmap was revealed and discussed at IMW this week, focusing on its plans for VCT DRAM and 3D DRAM, slated to arrive in 2025 and 2030.
